1. Simulation of Cu Surface Morphology Evolution during Electropolishing, S.R. Brankovic, N. Dole, A. Tripathi, NASF Annual Meeting, Las Vegas 19-21, (2016),
2. Critical Parameters of Solution and Process Design for Electrodeposition of Crack Free Cr Coatings, K. Ahmadi, T. Hall, E. J. Taylor and S. R. Brankovic, NASF Annual Meeting, Las Vegas 19-21, (2016),
3. (invited) Au Surface Chemo-Resistivity Improvement Using Metal Deposition via SLRR, K. Ahmadi, D. Wu, O. Montero, S.R. Brankovic, 67th ISE Meeting, Dan Hague, Netherland, August 21-25, (2016).
4. (invited) Ultra-Thin film Growth – Still a Lot of Things to be Discovered, S. R. Brankovic, Nucleation and Growth Research Conference, Sept. 27-29th, Kyoto, Japan (2016).
5. (invited) Exploring Different Concepts For 2D Cu Growth on Ru(0001) Assisted by Pb UPD Monolayer, D. Wu and S. R. Brankovic, 230th The Electrochemical Society Meeting, Oct. 2-7th, Honolulu, Hawaii, (2016).
6. Electroless Deposition of High Quality Co Films on Cu Polycrystalline Substrate Assisted by Pb UPD Monolayer, D. Wu, A. Joi, Y. Dordi, and S. R. Brankovic, 230th The Electrochemical Society Meeting, Oct. 2-7th, Honolulu, Hawaii, (2016).
7. Thin Film Surface Chemo-Resistivity Tuning Using Metal Deposition via SLRR, K. Ahmadi, D. Wu, O. Monteiro, and S. R. Brankovic, 230th The Electrochemical Society Meeting, Oct. 2-7th, Honolulu, Hawaii, (2016).